Sintering Mechanical Properties of SiC/nano-Ag/Cu: Molecular Dynamics Simulation

Abstract Nano-sintered silver has broad development prospects in the field of electronic packaging due to its excellent thermal conductivity and feasibility at low sintering temperatures. In this paper, by using molecular dynamics simulations, a single nano-silver particle is sintered, and its melting temperature range is obtained. Then, a SiC/nano-Ag/Cu sintered sample is prepared. By observing the formation process of the sintering neck, it is found that the sintering quality can be improved by prolonging the constant temperature time. Tensile simulations are performed on the sintered samples, and the traction-separation law curve is obtained. The initial yield strength of the sintered sample is 3.03 GPa, the elastic modulus is 28.99 GPa, and the fracture energy is 11.74 N/m according to the traction-separation law curve.