Direct-on-Chip Microscale Jet Array Impingement Cooling With Trapezoid Diversion Columns

Abstract Microscale jet array impingement cooling has been proved to be an efficient cooling technique for high-heat-flux electronics. In order to meet the current development trend of electronic components, jet impingement cooling performance needs to be continuously improved. In this work, a target surface enhancement approach for direct-on-chip microscale jet array with alternating feeding and draining jets was proposed. Trapezoid diversion columns were set regularly around inlet jets on the target surface to guide spent fluid and enhance overall performance. Besides, the inlet Reynolds number ranged from 20 to 2000 and deionized water was used as the coolant. Firstly, the impact of trapezoid diversion columns on flow and heat transfer characteristics was studied by numerical method. The results showed that the Nusselt number of current jet array was enhanced remarkably than that of convectional jet array at the almost same cost of pressure loss. Then the optimization of columns height, shape and location were carried out to improve overall performance. As a result, an optimal jet array structure with best overall performance was proposed. In the end, the maximum thermal removal capacity of optimal jet array and basic jet array was compared. It was found that the proposed optimal jet array can remove heat flux of 1950 W/cm2 when the temperature rise of heated surface was below 85 °C, which was 28.3% higher than that of basic jet array.