Motion: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers

D. Kuchta,M. Meghelli,P. Pepeljugoski,L. Schares, M. Schultz,P. Maniotis, P. Fortier, E. Tucotte, C. Bureau, M. Pion, Y. Cossette, G. Jutras, B. Sow, B. Parikh, S. Ostrander, S. Li, D. Becker,F. Gholami, H. Bagheri, F. Flens, G. Light, B. Wang

Optica Advanced Photonics Congress 2022（2022）

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摘要

We report on progress and results towards the development of a high speed, low cost, low energy (<4pJ/bit) chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.

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关键词

optical module,low energy chip scale,organic substrate,hpc,co-packaging,first-level

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