Temperature Distribution and Residual Stress Evolution at the Interface of Cucrzr/316 L Multi-Material by Laser Powder Bed Fusion

The defeats at the interface of copper/steel multi-material, such as cracks, are among the greatest challenges manufactured by Laser powder bed fusion (LPBF). Most of the previous researches have emphasized the impact of process parameters on the defeats of copper/steel multi-material interface by experimentation. It is significant to understand the thermal distribution and residual stress profile of copper/steel multi-material during LPBF process. In this work, a thermal-mechanical coupled finite element model is established to investigate the in-fluence of process parameters on thermal distribution and residual stress evolution of the CuCrZr/316 L multi -material interface. The results are verified by characterization experiments. Results reveal that higher residual stress is caused by growing scanning speed. The maximum residual stress is at CuCrZr/316 L multi-material interface. Numerous cracks at the CuCrZr/316 L multi-material interface are attributed to excessive residual stress. This work can provide novel perspectives to understanding the residual stress of multi-materials in the LPBF process.