Flexible Wafer-Scale Silicon-Photonics Fabrication Platform
Frontiers in Optics + Laser Science 2022 (FIO, LS)(2022)
摘要
We develop a wafer-scale CMOS-compatible platform and fabrication process that results in 300-mm-diameter flexible wafers, and experimentally demonstrate key functionality at visible wavelengths, including chip coupling, waveguide routing, and passive devices.
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