Modification copper surface by micron thickness film via thiol-based click reaction

Films with micron thickness were fabricated on copper via thiol-based click reaction between dithiol and epoxy group or vinyl ester group on silane without metal catalyst or light irradiation. The protection efficiencies were 99.6% and 99.4% for the epoxy silane and vinyl ester-silane participated click-assembly film, respectively. The driving force for film formation was the strong interaction between thiol and copper and then new C-S bond formation via thiol-ene or thiol-epoxy reaction. Molecular dynamics simulation further revealed the most stable adsorption configurations and the adsorption energy of the building blocks on copper substrate to provide theoretical support for experimental conclusion.