Densification Behavior, Mechanical and Electrical Properties of In-Situ TiB2p/Cu Composite Powder Via Vacuum Hot Pressing

The spherical TiB2p/Cu composite powder was prepared first by in-situ reaction coupled with the gas atomization method, then the bulk TiB2p/Cu composites with diffusely distributed sub-micron TiB2p were prepared by vac-uum hot pressing (VHP). The densification behavior of in-situ TiB2p/Cu composite powder compacts during sintering was investigated, indicating that the existence of TiB2p inhibits the densification. The ultimate tensile strength, conductivity and relative density of the sintered TiB2p/Cu composite are 400 MPa, 89.7% IACS and 99.7%, respectively, and the reasons for the high strength and conductivity of the composites were discussed. This work is expected to provide a technically viable solution for the preparation of high-performance TiB2p/Cu composite by VHP with in-situ composite powder.