Position-resolved timing characterisation tests of hexagonal and trench 3D silicon detectors

Matthew Addison,Cinzia Da Via,Adriano Lai,Gian-Franco Dalla Betta,Michela Garau,Andrea Lampis,Mauro Aresti, Alessandro Cardini,Gian-Matteo Cossu,Angelo Loi

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment（2023）

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摘要

Position-resolved timing characterisation tests were performed on individual pixels of hexagonal and trench 3D silicon sensors. An IR laser was used to deposit energy equivalent to 1 MIP with a 1μm spatial resolution onto each sensor, which were attached to custom-designed fast read-out electronics chips. Time of Arrival (ToA) values obtained were (544 ± 29.8) ps for the hexagonal geometry, and (515 ± 8.2) ps for the trench geometry.

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关键词

3D silicon,Timing characterisation

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