Mechanical behavior and texture evolution of integrated MCNTs/Cu composites with balanced electrical/thermal conductivity

The present study investigates the evolution of texture components and strengthening mechanisms that lead to achieve better mechanical properties in multiwalled carbon nanotube (MCNT)-reinforced copper matrix (MCNT/Cu) composites with optimized electrical and thermal properties. Herein, a coupled wet chemical route - spark plasma sintering (WCR-SPS) process is employed to produce MCNTx/Cu composite powder (x = 0.5, 0.7, 1.0 and 1.5 wt%) that allows strengthening of Cu matrix. Among tested variants, the MCNT1.0/Cu composite exhibits presence of a strong (111)γ-texture along with homogenous dispersion of Cu coated MCNTs in Cu matrix and thereby delivering improved strength (282 MPa) and ductility (32%). The MCNT1.0/Cu composite variant also delivers an optimum thermal conductivity (287 W/mK), electrical conductivity (82.1% IACS), and excellent mechanical properties. Furthermore, advantage of the proposed strategy is demonstrated by comparing experimental values with the corresponding theoretical models. The structure-property correlation and contribution of related strengthening mechanisms are also discussed.