Effect of substrate temperature on adhesion at liquid-aluminum/silica interface by phantom wall method

In this paper, the work of adhesion at the liquid-Al/solid SiO2 interface is evaluated by the "phantom wall" method. And the relationship between different substrate temperatures (100–800 K) and the adhesion of liquid-solid interface is discussed in detail. The results show that the liquid-Al is incompletely wetted on the SiO2 substrate. Also, the variations of the average adhesion force and adhesion work in the liquid-solid interface show that raising the substrate temperature can effectively reduce the adhesion of the liquid-Al on the SiO2. Moreover, the “competitive” effect of temperature on adhesion is elucidated by analyzing the change in substrate atomic density. During the adhesion process, the liquid-solid atoms squeeze and penetrate each other. The higher temperature increases the atomic consistency of the substrate surface. The consequence of the competition is that the Al atoms move away from the solid surface, thus leading to a weaker adsorption capacity. In addition, the adhesion between liquid-solid surface can be explained by the variation of the interfacial potential.