The Future of Holistic Neural Interfaces: 2D Materials, Neuromorphic Computing, and Computational Co-Design

2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDM(2022)

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摘要
The next leap in implantable neural interfaces requires technological advances in materials, devices, and computing paradigms. Holistic approaches integrating optical and electrical sensing modalities can overcome spatiotemporal resolution limits of neural sensing as well as open up new avenues for non-invasive neural recording. Integration of sensing, computation and memory on a single array can enable real-time processing of neural signals for compact, low-power and high-throughput brain machine interfaces. Here, we present this vision, its challenges, and discuss recent advances in the areas of transparent neural interfaces for multimodal recordings, neuromorphic approaches for on-chip neural processing and computational co-design at the system level for minimally invasive neural interfaces.
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关键词
brain machine interfaces,implantable neural interfaces,minimally invasive neural interfaces,neural recording,neuromorphic computing,on-chip neural processing,transparent neural interfaces
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