A Closer Look to Fan-out Panel Level Packaging

Tanja Braun,Ole Hoelck, Marcus Voitel,Mattis Obst,Steve Voges,Karl-Friedrich Becker,Rolf Aschenbrenner,Martin Schneider-Ramelow

2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM（2023）

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摘要

Fan-out Wafer and Panel Level Packaging are two of the dominating trends in microelectronics packaging. Both approaches with different flavors as RDL last face-up or face-down have reached maturity and are introduced in high volume manufacturing. This paper discusses warpage in detail as one key challenge in fan-out packaging and how to influence the warpage during processing of a reconfigured panel for Chip first/RDL last approach.

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关键词

Fan-out Panel Level Packaging,Warpage and Compression Molding

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