HRFF: Hierarchical and Recursive Floorplanning Framework for NoC-Based Scalable Multidie FPGAs

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS(2023)

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摘要
Emerging applications are calling for significantly larger FPGAs with multi-dies. However, the interconnection architecture of existing FPGAs lacks scalability. The execution time and failure probability of their RTL-to-Silicon process increase dramatically with the growth of design and the number of dies. To address this issue, we propose both an NoC-based scalable multi-die FPGA architecture and a corresponding floorplanning framework, namely Hierarchical and Recursive Floorplanning Framework(HRFF). First, from the architecture side, we introduce an interconnection architecture with a class of scalable hierarchical topology. Second, for the algorithm side, we formulate the generic floorplanning problem for NoC-based architectures as a multi-objective Mixed Integer Linear Programming (MILP) problem, balancing the design timing and interconnection workload. Third, we develop a novel recursive approximate method to efficiently solve the multi-objective MILP formulation over the proposed architecture, with a configurable trade-off between solution quality and solver run time. Experimental results show that the scalability of our proposed technique is at least $1.5 \times $ on all and $3 \times $ on certain benchmarks as that of the state-of-the-art solutions with no loss of design throughput.
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关键词
recursive floorplanning framework,fpgas,scalable,noc-based,multi-die
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