Investigation of Electrodeposited Copper Layer with Island Twinning Structure on Zr Substrate

In this study, the surface properties of copper layers on a zirconium substrate were investigated. The copper deposits with thicknesses of 25, 50, and 100 mu m were formed using the electroplating method. The evaluations of coating thickness, surface morphology, crystallite size, and grain distribution were performed by using the relevant analytical equipment. The results showed that by increasing the thickness of the copper layer, a more uniform cauliflower morphology was obtained. Also, by increasing the thickness of the copper deposit, the crystallite size was decreased from 70 to 20 nanometers and the strain energy was decreased from 2.9 x 10(-3) J to 6.5 x 10(-3) J. The copper layer with a thickness of 100 mu m was the most wear resistance compared to other coatings. The highest hardness value, uniform morphology, and more twin islands in different areas were the main reasons for improving the wear resistance of the copper layer with a thickness of 100 mu m.