Design and evaluation of a Substrate Integrated Waveguide with solid side walls for H-Band applications on organic substrate

2023 53RD EUROPEAN MICROWAVE CONFERENCE, EUMC(2023)

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摘要
This paper presents a substrate-integrated waveguide (SIW) on a commercial printed circuit board (PCB) process featuring solid side walls targeting applications in H-band (200GHz to 330 GHz). The realized structures are evaluated for their manufacturability, dimensional accuracy, and manufacturing tolerances. A transition from 100 mu m GSG probe tips to the SIW is designed and used to measure the SIW structures. Different through lengths are used to characterize the performance of the SIW. Due to severe manufacturing deviations and a slant to the side walls, modifications have to be made to the transition, which are investigated. Finally, a slotted waveguide antenna is realized and characterized.
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关键词
SIW,mmWave Packaging
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