Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC(2023)
摘要
Current microfabrication approaches face many challenges when scaling down to form copper lines of less than 2 mu m line/space width on organic substrates, resulting in issues such as lateral etching and undercut. In this work, a one-step Ar/H-2/Cl-2 plasma etching process has been developed, allowing to replace wet etching of the seed layer in the semi-additive process (SAP) approach. By optimizing the etch process, we demonstrate the fabrication of high-density copper-based RDL with an L/S of similar to 1.65 mu m with a Cu etch rate of 150 nm/min on a packaging substrate.
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关键词
high-density interconnects, plasma etching, copper, organic substrate, advanced packaging
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