Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC(2023)

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摘要
We report an efficient approach to integrate semiconductor laser array with photonic integrated circuits (PIC) in an optical transceiver architecture aiming for 1.6 Tbps. Key features including waveguide alignment layer, multi-tip edge coupler, pedestals, alignment marks, and under-bump metallization are used to achieve efficient integration and optical coupling.
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关键词
muti-tip edge coupler,laser diode flip chip bond
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