Secure and Scalable Key Management for Waferscale Heterogeneous Integration

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC(2023)

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摘要
In this paper, we assess PUF-based key management in emerging Chiplet technology. Our central idea is to leverage an existing capability in modern chiplet systems called utility dies (UD) and use it to provide security services (e.g., key management, encryption) to all functional chiplets on a wafer. We evaluate our design in a complex chiplet system. Specifically, we report system-related metrics of our implementation, including performance, power, and area overhead in a modern many-core chiplet system. Our evaluations show that the proposed design incurs negligible overhead and provides a viable option for key management in a complex chiplet system.
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关键词
hardware security, PUF, chiplet technology, waferscale integration
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