Low- Cost, HVM Singulation of Silicon Photonic ICs for Low- Loss Waveguide- To- Fiber Array Edge Coupling

Hiren D. Thacker, Tong Wang, Steve Moyer, Adam Forrer, Vitalis Amungwa, Phongsak Laotprasert, Amom Runarom, Mary Nadeau, Sandeep Razdan

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

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摘要

We present two high-volume manufacturing methods for producing edge-coupling waveguide 1/0s on silicon photonic ICs with pristine optical facets at the same time as wafer singulation. Low-optical loss coupling of fiber arrays to diced waveguides fabricated by each method is demonstrated along with reliability testing of the photonic IC-to-fiber array attachment.

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关键词

Photonics packaging, process integration, co-packaging, silicon photonics, assembly

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