The development of high performance in hybrid SiC power integrated module (PIM)

Due to wide bandgap electronic with high-speed exchange rate can efficiently improve the dynamic characteristics of the machine tool system. The high thermal conductivity of SiC can be applied to more than 10 kW of high power systems, which made it highly efficient, high temperature resistant and reliability. In this study, 1200V/100A hybrid SiC power integrated module (PIM) was designed and manufactured in ITRI. Through the thermal, electrical and stress simulation, the power module was designed to meet the function improvement and reliability. This study accomplished the different height of multi-chip simultaneous Cu sintering.