Packaging Technology for the Realization of Tx and Rx Modules Based on RTD Devices
2023 48TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES, IRMMW-THZ(2023)
摘要
This paper presents an integration concept for a single device resonant tunneling diode (RTD) broadband detector onto a low coast FR4 board. The assembly utilizes a flip-chip connection of the detector chip via a thermocompression bonding method. For broadband detection, an RTD detector with a logarithmic spiral antenna topology is chosen. To increase the stability of the interconnection against mechanical vibration, an additional underfill process employing an adhesive is performed. To enhance radiation coupling into the detector chip, a lens is mounted on the chip backside. With this arrangement a detector module is realized and characterized in the WR2.2 (330 GHz – 500 GHz) band with a responsivity of around 21.2 V/W and a noise equivalent power (NEP) of 156.6 pW/$\surd {\mathrm{Hz}}$.
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关键词
broadband detection,flip-chip connection,FR4 board,frequency 330.0 GHz to 500.0 GHz,logarithmic spiral antenna topology,NEP,noise equivalent,packaging technology,RTD detector chip devices,Rx modules,single device resonant tunneling diode broadband detector module,thermocompression bonding method,Tx modules,underfill process
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