Packaging and Characterization of Silicon and SiC-based Power Inverter Module with Double Sided Cooling

Thermal management and especially cooling attracts more and more attention during phases of conception and fabrication of power modules to increase their field operation time and/or power density. Indeed thermal power losses impact the reliability of power systems, which are in a same time converging towards always higher power density and performances. Since standard solder die attach and wire bonding are reaching their limits, a novel concept of assembly has been realized with double sided cooling (DSC), as fully integrated part of the power module. Half-bridge modules either based on IGBTs and silicon diodes or based on SiC- devices have been assembled by combining Transient Liquid Phase Bonding (TLPB) and Transient Liquid Phase Soldering (TLPS). SiC and silicon wafers were prepared by deposition of a high density area array of Cu posts. In order to switch 1200V / 25A copper posts were electroplated 80