Ultra-dense 3D integrated 5.3 Tb/s/mm² 80 micro-disk modulator transmitter

Stuart Daudlin,Sunwoo Lee, Devesh Kilwani,Christine Ou,Anthony Rizzo,Songli Wang,Michael Cullen,Alyosha Molnar,Keren Bergman

2023 Optical Fiber Communications Conference and Exhibition (OFC)（2023）

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摘要

A large-scale array of 80 micro-disk modulators is densely bonded to an electronic chip and driven at 10 Gb/s/modulator for an unprecedented 5.3 Tb/s/mm ² bandwidth density and 50 fJ/bit energy consumption.

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关键词

2 bandwidth density,bit rate 10.0 Gbit/s,bit rate 5.3 Tbit/s,electronic chip,energy consumption,large-scale array,microdisk modulators,ultra-dense 3d integrated microdisk modulator transmitter

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Ultra-dense 3D integrated 5.3 Tb/s/mm2 80 micro-disk modulator transmitter

Ultra-dense 3D integrated 5.3 Tb/s/mm² 80 micro-disk modulator transmitter