Heterogenous Photonic Integration for Quantum Optical Communication

Janez Krc,Andraz Debevc, Milos Ljubotina,Marko Topic,Isaac Luntadila Lufungula,Jasper De Witte,Leonardo Midolo, Claus Pedersen, Amir Hossein Ghadimi, Hamed Sattari, Michel Despont,Simone Ferrari,Wolfram Pernice,Dries Van Thourhout

2023 International Workshop on Fiber Optics on Access Networks (FOAN)（2023）

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摘要

Photonic integrated circuits (PICs) play an important role in telecom and datacom applications. While in the past integrated transceivers were the main driver for technological advances in integrated photonics, nowadays PICs are emerging in various other fields, such as sensing, high-performance computing, quantum technologies, and more [1]. Various material platforms for PICs have been developed and successfully utilized, like III-V semiconductors (InP, GaAs), silicon-based materials (Si, Si 3 N 4 , SiO 2 ), lithium niobate (LiNbO 3 ), polymers and others.

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关键词

Photonic integrated circuit,Heterogeneous integration,Micro-transfer printing,Quantum technologies,Optical communication,Device-independent quantum key distribution

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