Structure-Preserving Model Order Reduction for Thermal Analysis

2023 International Symposium of Electronics Design Automation (ISEDA)(2023)

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摘要
Accurate and fast thermal analysis is important for the 3D IC and SiP design with increasing complexity. Compact Thermal Model(CTM) combined with Model Order Reduction(MOR) is widely used in fast thermal analysis. However, the heterogeneous distribution structure is destroyed in traditional MOR strategies. In this paper, we propose a heuristic strategy to cut the original network into several blocks, which is followed by adaptive block-based MOR. Experiments show that compared with the state-of-the-art method, our method preserves the block structure in much less MOR time without burden on accuracy and subsequent simulation.
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关键词
IC Design,Thermal Analysis,Compact Thermal Model,Model Order Reduction
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