Ceramic Baseplate-Less 10 Kv SiC MOSFET Power Module with Integrated Liquid Cooling

Asger Bjorn Jorgensen,Szymon Beczkowski,Benjamin Futtrup Kjaersgaard,Thore Stig Aunsborg,Stig Munk-Nielsen,Hongbo Zhao

2023 25TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS, EPE'23 ECCE EUROPE（2023）

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摘要

A 3D printed ceramic baseplate-less power module structure with integrated micro-channels for liquid cooling is presented. The main benefit is that parasitic capacitive couplings are removed in comparison with conventional power module packaging. Switching waveforms at 60 kV/us exhibit limited overshoot while good thermal performance is maintained.

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关键词

Packaging,SiC MOSFET,Additive manufacturing,Parasitic elements,Thermal management

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