SIW Interposer for Cost-Effective RF-Integration and Packaging of Active-Phased Array Antenna

Mahmoud Mostafa,Wael M. Abdel-Wahab,Safieddin Safavi-Naeini

2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (AP-S/URSI)（2022）

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摘要

A transition between grounded coplanar waveguide (GCPW) and substrate-integrated waveguide (SIW) to form an interposer using ball gridded array (BGA) technology is presented for the first time. It allows for possible efficient and cost-effective 3D integration of multi-channel RFIC beam former into active-phased array antenna modular architecture. The interposer’s transition consists of embedded metallic via in SIW, and BGA used to couple RF-power between the SIW and GCPW structures. It is found that the two propagating modes, TE10 and Q-TEM in SIW and GCPW, respectively can be matched by properly optimizing the transition parameters. Simulation results are demonstrated in this paper.

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关键词

SIW interposer,cost-effective RF-integration,active-phased array,grounded coplanar waveguide,substrate-integrated waveguide,ball gridded array technology,BGA,cost-effective 3D integration,multichannel RFIC beam,couple RF-power,GCPW structures,transition parameters

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