Research on Etching of Distributed Bragg Reflector

This study investigated the effect of etching process parameters on the sidewall morphology and bottom metal etching damage of Distributed Bragg Reflector (DBR), and analyzed the underlying mechanisms. By comparing the etching morphology under different RF power and pressure conditions, it was found that increasing RF power and reducing pressure can solve the problem of sidewall fracture and obtain a smooth sidewall morphology. By comparing the effect of different process gases on the sidewall angle, it was found that adding O 2 can reduce the DBR/Photoresit selectivity and sidewall angle while adding BCl 3 can increase the DBR/Photoresit selectivity and sidewall angle. Therefore, the sidewall angle can be adjusted by controlling the type and flow rate of the etching gas. By comparing the DBR/metal selectivity under different RF power, it was found that as the RF power decreases, the DBR/metal selectivity increases, which can prevent metal splashing caused by over-etching of metal. Therefore, in DBR etching, high RF power is used for main etching to obtain a smooth sidewall morphology and the sidewall angle can be adjusted by varying the gas type and flow rate, while low RF power is used for over-etching to improve the DBR/metal selectivity and prevent metal over-etching. This study has reference significance for the development of the inverted chip DBR process.