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Microstructural and Electrical Resistivity of TiN Electrode Films Prepared by Direct Current (DC) Reactive Magnetron Sputtering

SCIENCE OF ADVANCED MATERIALS(2023)

Zunyi Normal Coll

Cited 1|Views16
Abstract
In this study, the crystal structure as well as electron transport of TiN thin films were evaluated. We used DC reactive magnetron sputtering to deposit a thin layer of polycrystalline titanium nitride (TiN) on a Si (100) substrate starting from elemental Ti in a nitrogen atmosphere. The influence of nitrogen flow rate on the crystal structure, surface morphology, and electron transport of TiN were investigated systematically. It was found that the preferred orientation and conductivity of TiN thin films exhibit strong nitrogen flow rate dependence. The preferred orientation changed from (111) to (200) initially and then changed back to (111) as the nitrogen flow rate increases. However, an increase in the (200) phase leads to higher conductivity and lower surface roughness. At the optimized deposition conditions, ultra-thin (around 30 nm) TiN thin films with a low resistivity of 101.8 μ C·cm and a surface roughness of less than or equal to 0.51 nm were obtained. These superior performances, along with low running costs, suggest that TiN thin films have great potential for use as electrodes in microelectronic devices.
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TiN Films,Preferred Orientation,Reactive Sputtering,Resistivity,Microstructure
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要点】:本研究通过直流反应磁控溅射技术制备TiN薄膜,并探究了氮气流量对薄膜晶体结构、表面形态及电子输运性能的影响,发现氮气流量对TiN薄膜的择优取向和导电性有显著影响。

方法】:采用直流反应磁控溅射技术,在Si (100) 衬底上从元素钛在氮气氛围中沉积多晶钛氮化物(TiN)薄膜。

实验】:通过改变氮气流量,研究了TiN薄膜的晶体结构、表面形貌和电子输运性能,发现氮气流量影响TiN薄膜的择优取向,从(111)变为(200),再变回(111)。在优化条件下,获得了低电阻率(101.8 μΩ·cm)和表面粗糙度小于等于0.51 nm的约30 nm厚的TiN薄膜。实验使用的数据集为氮气流量变化下的TiN薄膜性能数据。