Photonic System-in-Package (pSiP) by Applying Thin Glass

Henning Schröder,Oliver Kirsch,Daniel Weber,Julian Schwietering

2023 IEEE CPMT Symposium Japan (ICSJ)（2023）

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摘要

Advanced photonic System-in-Package (pSiP) technologies are proposed to enhance functionality of photonic packages featuring electrical, thermal and optical components including laser diodes, modulators, isolators, PIC, beam-splitters and micro lenses. We discuss thin glass as a suitable base material for packages made on panel level, precise glass structuring, optical waveguide integration, electrical wiring and the related high precision assembly techniques.

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关键词

photonic system in package,thin glass,panel level packaging,optical waveguides,micro-optics,automated assembly

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