Applicability of ultrasonic welding to Ag-stabilized REBCO CC joints and evaluation of their electromechanical properties

Abstract Manufacturing a single long-length rare-earth barium copper oxide (REBCO) coated conductor (CC) tape with uniform critical current ( I c ) is still a challenge; therefore, joining between multiple-length CC tapes is needed in the production of longer CC tapes for superconducting cables, coils, and magnets. Various joining techniques have been developed to achieve acceptably low joint resistance ( R j ) with no I c degradation and good electromechanical properties. The authors established ultrasonic welding (UW) and hybrid welding (HW) methods for joining Cu-stabilized CC tapes with different configurations. However, these methods have yet to be applied to Ag-stabilized CC tapes to produce compact joints and longer tapes during in-line production. This study used the UW and HW methods to fabricate Ag-stabilized CC joints to have low R j without I c degradation through a direct connection at the overlapped Ag layers between both CC tapes. Two CC tape samples with different thicknesses of ∼2 µ m and ∼6 µ m Ag stabilizers were supplied to produce UW and HW Ag-stabilized CC joints. These were compared with soldered CC joints fabricated by a mechanically controlled soldering method. In the case of UW, the design of experiment using the Taguchi method was used to systematically determine the optimized weld parameter combination that yields a lower R j without any I c degradation. This study is a systematic attempt to evaluate the applicability of UW for solid-state joining between thin Ag layers, unlike the conventional joining of thick Cu stabilizers. Moreover, the electromechanical properties of differently processed Ag-stabilized REBCO CC joints were evaluated using both lap-shear and double-bending tests. As a result, the optimum UW parameter combinations were obtained to achieve Ag-stabilized CC joints. However, some variations were probably due to the differences in the production batch and thickness of the Ag layers. The UW Ag-stabilized CC joints showed superior joint characteristics and electromechanical properties compared to soldered CC joints. Good solid-state bonding of the Ag layers was observed through microscopic observation of the cross-section at the joint region of the UW CC joint. The joint characteristics and electromechanical properties of the UW Ag-stabilized CC joints can be further improved using the HW method.