Structural Adhesive-Loaded Fiber Membranes with Temperature Overload Reinforcement

A two-step method was utilized to prepare high-performance thermoplastic polyimide (TPI) solutions, which were further spun into nanofibrous membranes by electrostatic spinning and equipped with adhesives for use. The resulting TPI nanofibrous membranes (TPI NFMs) act as both an adhesive carrier and reinforce the bonding effect at high temperatures. At room temperature, the T-type peel strength of the best ratio film was 6.09 N/mm, and the shear strength was 28.19 MPa. After high-temperature aging, the TPI NFMs fill cracks produced by adhesive decomposition and oxidation, enhancing the bonding by compensating for defects. After 0.5 h of aging, the T-type peel strength decreased by 3%, and the shear strength decreased by 10.7%. After 2.5 h of aging, the T type peel strength decreased by 34.3%, and the shear strength decreased by 32.6%.