Inducing low-temperature melting of TiNiCuNb eutectic alloy for manufacturing strong C/C-SiC composite joints

This work designed a novel TiNiCuNb eutectic alloy for manufacturing C/C-SiC composite joints. By introducing Ti into the semi-solid TiNiCuNb alloy, low-temperature melting of this eutectic alloy was induced. Ti/TiNiCuNb/ Ti composite interlayers were utilized to join C/C-SiC composite lower than the melting temperature of TiNiCuNb alloy. Effects of joining temperature on the microstructure evolution and mechanical property of joints were investigated. The melting range of this TiNiCuNb alloy was 944 degrees C to 1064 degrees C. During the initial melting of the TiNiCuNb alloy, a thin liquid layer formed on the alloy's surface, which provided a path for the rapid diffusion of elements. Without pressure, Ti could be easily introduced into the TiNiCuNb alloy, which induced the complete melting of this alloy at 950 degrees C. Based on this, we successfully brazed C/C-SiC composite using Ti/ TiNiCuNb/Ti interlayers. It not only hindered the formation of brittle compounds in the joints, but also weakened the overreaction between filler and C/C-SiC composite. Due to the high solubility of Si in liquid filler, the joint microstructure was controlled by the interaction between filler and SiC at different temperatures. At 1010 degrees C for 10 min, the maximum shear strength of 28.5 MPa was obtained. This work contributed to preparing and repairing the C/C-SiC composite.