3D-ISC: A 65nm 3D Compatible In-Sensor Computing Accelerator with Reconfigurable Tile Architecture for Real-Time DVS Data Compression.

Gokul Krishnan, Gopikrishnan Raveendran Nair,Jonghyun Oh,Anupreetham Anupreetham, Pragnya Sudershan Nalla,Ahmed Hassan,Injune Yeo, Kishore Kasichainula,Jae-sun Seo,Mingoo Seok,Yu Cao

2023 IEEE Asian Solid-State Circuits Conference (A-SSCC)(2023)

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摘要
A dynamic vision sensor (DVS) outputs a sequence of digital events, each representing a change in brightness at a particular time. As DVS keeps scaling down the pixel size and increasing the resolution, a larger volume of data is generated at limited bandwidth, resulting in reduced system-level throughput, as shown in Fig. 1(a). Hence, conventional interconnect solutions cannot meet the requirement of real-time data output from a high-speed DVS.
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