Influence of Cu interlayer on the interfacial strengthening of the diffusion-bonded SS-304L/IN718

Salman Khan,Massab Junaid,Tauheed Shehbaz,Fahd Nawaz Khan

Materials Letters（2024）

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摘要

•Investigate the influence of Cu interlayer on of DB IN718/SS-304L interface.•Cu interlayer significantly reduced the formation of IMCs and carbides.•Joint strength of 143 MPa was achieved without Cu interlayer.•Joint strength was improved by 134% using Cu interlayer.•Microhardness was reduced by 17% with the Cu interlayer.

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关键词

Diffusion bonding,Microstructure,Inconel 718,Copper interlayer,Intermetallic compound: X-ray techniques

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