Wideband Four-Port 3-D Interconnection Based on SIW for Multi-Port Connection

Haoran Ye, Xurui Zhang,Yan Zhang,Bingchen Bai, Rongke Liu

2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)(2023)

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摘要
In this paper, a wideband 3-D interconnection based on Substrate-Integrated Waveguide(SIW) is proposed. Its four ports which contain two input ports and two output ports constitute two isolated transmission paths. Compared with the previous vertical interconnection, the number of dielectric is less. And the performance of amplitude and phase consistency of the two paths are good in wideband, which can satisfy the demand of more complex multi-port connections at high frequency with low loss. The simulation results shows the transmission coefficient is better than 0.4dB and the phase error is ± 15° in 27-33GHz. The 8 × 8 connection consist of several 3-D interconnections is established. More ports and the different arrangement of input ports and output ports enables the connection to satisfy the demand of more complex and irregular connection in beamforming networks.
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关键词
Substrate-Integrated Waveguide (SIW),3-D Interconnection,Multi-port Beamforming Network,Wideband
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