High thermal conductivity in three-dimensional boron nitride/epoxy composites by engineered favorable interfacial adhesion between boron nitride sheets

Because of their excellent insulation performance and processing properties, polymers are widely used in electrical and electronic applications. However, their further applications are severely constrained by their extremely low intrinsic thermal conductivity. Boron nitride (BN), which has high thermal conductivity and ideal insulation properties, is commonly used as a filler for improving the thermal conductivity of polymers. However, the high chemical inertia of the surface of BN makes it difficult to achieve an interconnection of BN sheets when building a three-dimensional (3D) BN skeleton in a polymer. In this study, urea melt pore preparation (UMPP) was used to fabricate a 3D BN skeleton. Urea was infiltrated into the BN skeleton to minimize the interfacial thermal resistance among the BN flakes and to join BNs. When the volume of a BN is 10 %, the thermal conductivity of the BN/epoxy composites is 3.15 W/(m·K). When the BN volume is 80 %, the thermal conductivity of BN/epoxy can reach 13.65 W/(m·K), which is 6500 % of pure epoxy resin. Additionally, the skeleton exhibits a remarkable mechanical strength capable of supporting weights up to 50,000 times its own, which facilitates easier handling and operation. The electrical resistivity volume of the UMPP composite is as high as that of the pure epoxy, whereas the dielectric loss is lower than that of pure epoxy. This study provides a new method for reducing internal interface thermal resistance of a skeleton formed by thermal conductive fillers with high chemical inertia such as boron nitride.