IGBT Thermal Model Theory and Analysis for Device-To-System-Level Electrothermal Simulations

Yiping Lu,Enyao Xiang,Lin Zhu,Haoze Luo,Huan Yang,Rongxiang Zhao

2023 IEEE 2nd International Power Electronics and Application Symposium (PEAS)（2023）

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摘要

Based on the different requirements for the IGBT thermal model from the device to the system level, the different timescales of the time constants of each layer of the device package structure are used to establish an IGBT thermal model for device-to-system-level thermal simulations. Simulation results verify its accuracy.

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关键词

Thermal network model,device-to-system,junction temperature,model accuracy

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