Security Advantages and Challenges of 3D Heterogeneous Integration

Yuntao Liu,Daniel Xing, Isaac Mcdaniel, Olsan Ozbay, Abir Akib, Mumtahina Islam Sukanya, Sanjay Rekhi,Ankur Srivastava

COMPUTER（2024）

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摘要

Three-dimensional heterogeneous integration offers compelling opportunities to enhance the security and trust in the current semiconductor chain while new attack surfaces may emerge.

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关键词

Three-dimensional displays,Multichip modules,Computer security

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