Low-Cost Scalable PCB-Based 2-D Transducer Arrays for Volumetric Photoacoustic Imaging

Mahaan Mitra, Akshay Kumar,Shubham Khandare,Prameth Gaddale, Yashoda Anandan, Srian Pedibhotla,Kaustav Roy,Haoyang Chen,Rudra Pratap,Sri-Rajasekhar Kothapalli

IEEE SENSORS JOURNAL(2024)

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摘要
Photoacoustic (PA) imaging provides deep tissue molecular imaging of chromophores with optical absorption contrast and ultrasonic resolution. Present PA imaging techniques are predominantly limited to one 2-D plane per acquisition. The 2-D ultrasound (US) transducers, required for real-time 3-D PA imaging, are high cost, complex to fabricate, and have limited scalability in design. We present novel printed circuit board (PCB)-based 2-D matrix US transducer arrays that are capable of being bulk manufactured at low cost without using laborious US fabrication tools. The 2-D US array specifications are easily scalable with respect to widely available PCB design tools. To demonstrate scalability, we fabricated low-frequency (11 MHz) 8 x 8 matrix array and high-frequency (40 MHz) 4 x 4 matrix array by directly bonding an undiced polyvinylidene difluoride (PVDF) piezo-electric material of desired thickness to the custom designed PCB substrate. Characterization results demonstrate wideband PA receive sensitivity for both the low-frequency (6-dB bandwidth: 87%) and the high-frequency (6-dB bandwidth: 188%) arrays. Volumetric PA imaging results of light-absorbing targets inside optical scattering medium demonstrate improved spatial resolution and field of view (FOV) with an increase in aperture size.
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关键词
2-D matrix transducer array,beamforming,photoacoustic (PA) imaging,polyvinylidene difluoride (PVDF),printed circuit board (PCB),ultrasound (US) transducer fabrication
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