Materials for High Temperature Digital Electronics
arxiv(2024)
摘要
Silicon microelectronics, consisting of complementary metal oxide
semiconductor (CMOS) technology, have changed nearly all aspects of human life
from communication to transportation, entertainment, and healthcare. Despite
the widespread and mainstream use, current silicon-based devices suffer
significant reliability issues at temperatures exceeding 125 C. The
emergent technological frontiers of space exploration, geothermal energy
harvesting, nuclear energy, unmanned avionic systems, and autonomous driving
will rely on control systems, sensors, and communication devices which operate
at temperatures as high as 500 C and beyond. At these extreme
temperatures, active (heat exchanger, phase change cooling) or passive (fins
and thermal interface materials) cooling strategies add significant mass and
complication which is often infeasible. Thus, new material solutions beyond
conventional silicon CMOS devices are necessary for high temperature, resilient
electronic systems. Accomplishing this will require a united effort to explore
development, integration, and ultimately manufacturing of non-silicon-based
logic and memory technologies, non-traditional metals for interconnects, and
ceramic packaging technology.
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