Feasibility evaluation of near dissolved organic matter microfiltration (NDOM MF) for the efficient removal of microplastics in the water treatment process

Uje Lee, Kyeongyeon Park, Seungwon Chang,Min Cho,Jaewoo Lee

Chemosphere(2024)

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摘要
Microfiltration (MF) using membranes with a mean pore size smaller than 0.45 μm has generally been used for particle removal from water, given that materials larger and smaller than 0.45 μm are regarded as particulates and dissolved organic matter (DOM), respectively. It is also the case for removing small-size microplastics (MPs). However, given their sizes (ca. 1 μm), there is room for further improvement of the productivity (i.e., water flux) in the pore size range of 0.45–1 μm on the condition that the removal rate is maintained. With this in mind, MF's water flux and removal rate were tested using seven different MF membranes, and the right pore, with the size of 0.8 μm, was found for MP removal, which is called near DOM (NDOM) MF. In the filtration test using polystyrene surrogate beads with an average particle diameter of 1.20 μm, NDOM MF exhibited a 1.7 to 13 times higher permeate flux than the conventional MF using 0.1, 0.2, and 0.45 μm membranes while maintaining a higher removal rate than 2 log. The excellent removal rate of the NDOM MF was attributable to the following three factors: (1) smaller mean pore size than the average particle diameter, (2) particle screening effect enhanced by the secondary layer formed by surface deposition, and (3) symmetric sublayer structure favorable for capturing penetrated particles. Furthermore, the outstanding filtration performance also appeared in a low-temperature (<10 °C) process, demonstrating that NDOM MF is feasible independently of temperature. Additionally, in constant flux filtration, NDOM MF demonstrated the long-term feasibility by lowering the transmembrane pressure and specific filtration energy by more than 2 times.
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关键词
Water treatment,Microplastic,Near dissolved organic matter microfiltration,Membrane,Particle removal mechanism,Secondary layer
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