Implementing Remote Doping and Suppressed Scattering in MoS $_{\text{2}}$ Field-Effect Transistor Using CMOS-Compatible Process
IEEE Transactions on Electron Devices(2024)
摘要
Doping technologies for 2-D materials, such as substitutional doping or molecular surface doping, inevitably introduce scattering caused by ionized dopants, resulting in carrier mobility degradation. Moreover, these processes are not CMOS-compatible and therefore hinder practical integration. In this study, we report the realization of remote doping and reduced carrier scattering in molybdenum disulfide (MoS
$_{\text{2}}$
) field-effect transistor (FET) with silicon oxynitride/alumina (SiO
$_{\textit{x}}$
N
$_{\textit{y}}$
/AlO
$_{\textit{x}}$
) encapsulation layer fabricated by CMOS-compatible process. Charged dopants in SiO
$_{\textit{x}}$
N
$_{\textit{y}}$
remotely dope the underlying MoS
$_{\text{2}}$
channel by inserting a high-
k
dielectric AlO
$_{\textit{x}}$
, keeping themselves spatially separated from the channel and contributing to an increase in carrier density and mobility. By depositing a charge modulation layer SiO
$_{\textit{x}}$
N
$_{\textit{y}}$
, it is possible to achieve an electron density change (
$\Delta \textit{n}$
) of 2.2
$\times$
10
$^{\text{12}}$
cm
$^{-\text{2}}$
. Additionally, the remotely doped MoS
$_{\text{2}}$
FETs exhibit improved contact and increased room-temperature mobility compared to the pristine MoS
$_{\text{2}}$
FETs. Furthermore, the temperature-dependent characterization of the remotely doped MoS
$_{\text{2}}$
FET demonstrates significant suppression of charged impurity scattering.
更多查看译文
关键词
2-D field-effect transistor (2D FET),charged impurity scattering,defective SiO $_{\textit{x}}$ N $_{\textit{y}}$,molybdenum disulfide (MoS $_{\text{2}}$ ),remote doping
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要