Prediction of Electromagnetic Leakage from Circuits inside Package

2023 24th International Conference on Electronic Packaging Technology (ICEPT)(2023)

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摘要
In this paper, we use the equivalent sources based on near-field scanning to predict the electromagnetic leakage produced by circuit inside package. First, we use the near-field scanning system to obtain the electromagnetic information above the radiation source. Next, we calculate the equivalent electric and magnetic dipoles array of the radiation source. Finally, we predict the electromagnetic leakage by put the dipoles array into package simulation model. The accuracy of the proposed method has been verified through a practical measurement example.
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关键词
source reconstruction,Near-field scanning,electromagnetic interference (EMI)
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