Holistic Material Design for Reliability of Electronic Based Systems

A holistic material design for reliability (DfR) concept in electronic systems is addressed. It is based on (1) electrical, thermal, and mechanical analysis to study and predict material properties when used as a part of an electronic system; (2) failure oriented accelerated testing (FOAT) to understand the physics-of-failures and quantify on a probabilistic basis the outcome of FOAT conducted on the most critical materials of the electronic system; and (3) physical and data driven predictive models (PM), both analytical and numerical, aimed at bridging the gap between process parameter, FOAT data, and field conditions. The holistic material DfR concept contributes to the key elements of reliability and robust design of electronic systems, namely performance, durability, quality, and lifetime.