Universal Hydrogel Adhesives with Robust Chain Entanglement for Bridging Soft Electronic Materials

Abstract Ensuring stable integration of diverse soft electronic components for reliable operation under dynamic conditions is crucial. However, integrating soft electronics, comprising various materials like polymers, metals, and hydrogels, poses challenges due to their different mechanical and chemical properties. This study introduces a dried-hydrogel adhesive made of poly(vinyl alcohol) and tannic acid multilayers (d-HAPT), which integrates soft electronic materials through moisture-derived chain entanglement. d-HAPT is a thin (~ 1µm) and highly transparent (over 85% transmittance in the visible light region) adhesive, showing robust bonding (up to 3.6 MPa) within a short time (< 1 min). d-HAPT demonstrates practical application in wearable devices, including a hydrogel touch panel and strain sensors. Additionally, the potential of d-HAPT for use in implantable electronics is demonstrated through in vivo neuromodulation and electrocardiographic recording experiments while confirming its biocompatibility both in vitro and in vivo. It is expected that d-HAPT will provide a reliable platform for integrating soft electronic applications.