Diamond Coatings on Copper Surfaces Through Interface Engineering

To address the challenges posed by the significant thermal stress and limited affinity of diamond coatings on copper (Cu) substrates, we developed a method combining femtosecond (fs) laser texturing with the application of a nickel (Ni) interlayer. This technique was utilized for adhesion enhancement of diamond coatings on Cu. By varying the deposition duration and microgrid depth through multiple fs laser scanning passes, it is possible to attain well-adhered diamond coatings on Cu substrates. These coatings demonstrate an outstanding quality factor of 93.4 % and an average grain size of 5.5 μm. The enhanced adhesion results from the synergistic reinforcement of the mechanical interlock and anchoring mechanisms facilitated by the textured surface, further bolstered by the presence of the Ni interlayer. Moreover, the shape of the texture significantly influences the deposition outcome. Single-crystal diamonds with an average grain size of 10 μm were achieved on sharp microgrids at a substrate temperature of 550 °C. This work is expected to offer a general approach for deposition of diamond coatings on metallic materials with enhanced adhesion.