Residual stress and subsurface damage in sapphire ultra-precision grinding

This study conducted experiments on ultra-precision grinding of sapphire using various strategies. It evaluated surface and subsurface characteristics across multiple dimensions, including morphology, scale, mechanical properties, residual stresses, lattice distortions, in-service properties, and chemical components. The research aimed to explore the intrinsic relationship between these behaviours. The findings revealed that both semi-finish grinding and ultra-precision grinding achieved ductile and low-roughness surfaces, with surface hardness enhancement near the grinding surface. Additionally, Raman spectra wave shifts were able to distinguish residual stresses at different grinding strategies, with larger stresses observed in ultra-precision grinding compared to semi-finish grinding and rough grinding. Furthermore, dense etching dislocation pits were observed on the ultra-precision grinding surface, responding to the scale of residual stress. The presence of larger subsurface cracks in semi-finish grinding and rough grinding was found to contribute to the release of residual stress. Moreover, ultra-precision grinding significantly reduced subsurface damage compared to rough grinding, with a reduction from 23.8 μm to 4.3 μm. Photothermal absorption during rough grinding was noted to be over 10 times higher than in ultra-precision grinding. Transmission electron microscopy (TEM) analysis revealed that subsurface damage included microcrack-induced line defects and uniform plastic deformation areas. This damage involved lattice aberrations, dislocations, stacking faults, and thin amorphous layers. The hardness and modulus of the subsurface damage layer were observed to decrease. Additionally, Raman spectra wave shifts were able to distinguish the subsurface damage layer in ultra-precision grinding. Energy-dispersive X-ray spectroscopy (EDS) analysis showed no change in the chemical components of the subsurface damage layer. Furthermore, a model was proposed to evaluate subsurface damage based on residual stress, and the mechanism of residual stress inducing damage in ultra-precision grinding was further analysed.