A Jet Impingement Cooling Method to Mitigate the Inherent Uneven Temperature of Multi-chips in Power Modules

The design of heat sinks is crucial for power modules in power electronic systems. Jet impingement cooling has been proven to be an efficient and compact solution. However, previous designs considered that the losses of each chip inside the power module are uniform. This can lead to the emergence of hot spots. The inconsistent loss of multi-chip within the power module is caused by mismatched parasitic parameters and thermal resistances. An unbalanced hot-spot-based jet impingement cooling concept is proposed to suppress the inherent uneven temperature of power modules. The effectiveness of this method is verified by theoretical modeling and experiments tentatively. In the future, the proposed cooling concept for heat sink design considering electro-thermal coupling will be more carefully sought and verified in experiments on converter operation.