Multi-scale surface folding in metal cutting

In this work, commercially pure small-grained copper is used to investigate the nature of plastic flow through in situ image analysis supported by extensive electron backscatter diffraction characterization of the chip. Non-laminar sinuous flow, manifested with surface perturbations (bumps) and folds, produces a highly heterogeneous strain field during cutting. A series of mushroom-shaped morphology, termed as large bumps, separated by large folds on the free surface of the chip are captured in high-resolution field emission scanning electron microscopy. Large bumps or folds, captured in the high-speed camera, consist of many medium and small-size bumps. While the size of the small bump is comparable with the grain size of the base metal, a cluster of grains takes part in forming medium-size bumps. The pinning points for the small size bumps are either grain boundary or hard grains. The hard grains also act as pinning points for the medium size bump. The bump boundaries (folds) are characterized by higher strain and greater refinement of grains, whereas, less strain and larger elongated grains are the characteristics of the central region of the bumps. The evolution of different length scale features on the free surface is discussed in terms of the orientation of grain, position of the grains on the surface, and induced strain in the chip. This study suggested that the development of folding at different length scales is capable of providing deeper insight into the formation of a wide variety of chip morphology observed during the cutting of metals.